The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jun. 18, 2019
Autonetworks Technologies, Ltd., Mie, JP;
Sumitomo Wiring Systems, Ltd., Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Yasunori Asano, Mie, JP;
Motoki Kubota, Mie, JP;
AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;
SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Abstract
It is aimed to prevent the breakage of solder joint portions due to the thermal deformation of a molded body. A circuit board device (A) includes a circuit board (), a cover () and a molded body () to be provided on the circuit board (), and a board connector () to be surface-mounted on the circuit board (). The board connector () includes a housing () and metal members () integrally mounted in or on the housing (). The board connector () is surface-mounted on the circuit board () by solder-joining the metal members (). The molded body () is made of synthetic resin and surrounds the circuit board () and the metal members () in a solder joint state. The cover () is embedded in the molded body () while being disposed to surround the metal members ().