The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Jul. 04, 2019
Applicant:

Sae Magnetics (H.k.) Ltd., Hong Kong, HK;

Inventors:

Wei Xiong, Hong Kong, HK;

Atsushi Iijima, Hong Kong, HK;

Assignee:

SAE Magnetics (H.K.) Ltd., Hong Kong, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H01L 41/09 (2006.01); H01L 41/18 (2006.01); H01L 41/316 (2013.01); G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0471 (2013.01); H01L 41/0474 (2013.01); H01L 41/0475 (2013.01); H01L 41/0913 (2013.01); H01L 41/0986 (2013.01); H01L 41/18 (2013.01); H01L 41/316 (2013.01); G11B 5/483 (2015.09);
Abstract

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.


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