The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Feb. 11, 2021
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 21/308 (2006.01); H01L 21/306 (2006.01); H01G 4/005 (2006.01); B01J 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 28/92 (2013.01); H01L 28/40 (2013.01); H01L 28/91 (2013.01); B01J 23/40 (2013.01); H01G 4/005 (2013.01); H01L 21/308 (2013.01); H01L 21/30604 (2013.01); H01L 28/60 (2013.01);
Abstract
According to an embodiment, a structure includes a substrate including a semiconductor material, wherein the substrate is provided with one or more recesses each of which has a depth direction that is equal to a thickness direction of the substrate, and the one or more recesses include a sidewall on which a plurality of grooves each extending in the depth direction are provided.