The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Sep. 11, 2020
Applicant:

L3 Cincinnati Electronics Corporation, Mason, OH (US);

Inventors:

Yajun Wei, Saratoga, CA (US);

Daniel Chmielewski, Mason, OH (US);

Nansheng Tang, Mason, OH (US);

Darrel Endres, West Chester, OH (US);

Michael Garter, Lebanon, OH (US);

Mark Greiner, Loveland, OH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14652 (2013.01); H01L 27/1462 (2013.01); H01L 27/1465 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01);
Abstract

Methods of fabricating multicolor, stacked detector devices and focal plane arrays are disclosed. In one embodiment, a method of fabricating a stacked multicolor device includes forming a first detector by depositing a first detector structure on a first detector substrate, and depositing a first ground plane on the first detector structure, wherein the first ground plane is transmissive to radiation in a predetermined spectral band. The method further includes bonding an optical carrier wafer to the first ground plane, removing the first detector substrate, and forming a second detector. The second detector is formed by depositing a second detector structure on a second detector substrate, and depositing a second ground plane on the second detector structure. The method further includes depositing a dielectric layer on one of the first detector structure and the second ground plane, bonding the first detector to the second detector, and removing the second detector substrate.


Find Patent Forward Citations

Loading…