The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Nov. 15, 2019
Applicant:
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Shenzhen, CN;
Inventors:
Chuanbao Luo, Shenzhen, CN;
Dai Tian, Shenzhen, CN;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 23/532 (2006.01); H01L 29/45 (2006.01); H01L 29/786 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 27/127 (2013.01); H01L 21/32134 (2013.01); H01L 23/532 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1259 (2013.01); H01L 27/1288 (2013.01); H01L 29/45 (2013.01); H01L 29/7869 (2013.01);
Abstract
A method for manufacturing an array substrate and a array substrate are provided. The method includes steps of sequentially forming a first metal structure layer, an insulating layer, a semiconductor layer, and a second metal structure layer on the substrate. The first metal thin film layer and the second metal thin film layer are etched with an electrolyte solution to form a patterned second metal structure layer. The patterned second metal structure layer includes a source and a drain.