The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jun. 11, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Takuma Shimoichi, Kyoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H03H 7/01 (2006.01);
U.S. Cl.
CPC ...
H01L 27/016 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H03H 7/0115 (2013.01);
Abstract
The present invention provides a chip component that achieves outstanding LC characteristics. The present invention provides a chip component (), including: a substrate (); an inorganic insulating layer (), formed on the substrate (); an organic insulating layer (), formed on the inorganic insulating layer (); and an LC circuit (), including a first capacitor (C) formed in the inorganic insulating layer (), and a first inductor (L) formed, in a manner of being electrically connected to the first capacitor (C), in the organic insulating layer ().