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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11410943 B1

PDFFull Text
Date of Patent:
Aug. 09, 2022

Filed:

May. 16, 2019

Active element, high-frequency module, and communication device

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Hisanori Murase, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Lana N Le

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H04B 1/40 (2015.01); H04B 1/48 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/12 (2013.01); H01L 24/17 (2013.01); H04B 1/40 (2013.01); H04B 1/48 (2013.01); H05K 1/0216 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/17181 (2013.01); H01L 2924/00014 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.

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