The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Sep. 04, 2020
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Miwako Suzuki, Kanagawa, JP;
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor package includes a semiconductor chip, a sealing resin that has a flat plate shape and seals the semiconductor chip inside, a first electrode that includes a first mounting surface exposed on a first main face of the sealing resin, a second electrode that includes a second mounting surface exposed on the first main face, and a groove provided on the first main face. The first mounting surface includes a first end portion arranged in an inner region of the first main face and opposed to the second electrode. The groove includes a first connection portion connected to the first end portion, and a second connection portion connected to a lateral face of the sealing resin.