The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Nov. 24, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Christian Schweikert, Munich, DE;

Alexander Kospach, Graz, AT;

Sebastian Paul Hans Moeller, Maribor, SI;

Benedikt Rabl, Graz, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01);
Abstract

A fluid channel for a power semiconductor module includes a die carrier configured to carry a plurality of semiconductor dies on a first side, a plurality of cooling elements arranged on a second side of the die carrier opposite the first side, and a channel wall arranged opposite the second side of the die carrier and forming a cavity. The cooling elements are arranged in the cavity. The cooling elements are attached to the die carrier at attachment points. A majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.


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