The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Jun. 21, 2021
Applicant:

Assembléon B.v., Eindhoven, NL;

Inventors:

Roy Brewel, Liempde, NL;

Richard A. Van Der Burg, Eindhoven, NL;

Rudolphus H. Hoefs, Eindhoven, NL;

Wilhelmus G. Van Sprang, Eindhoven, NL;

Assignee:

ASSEMBLEON B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.


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