The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

May. 14, 2021
Applicant:

Longitude Licensing Limited, Dublin, IE;

Inventor:

Yoshinori Matsui, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G06F 13/42 (2006.01); G11C 11/4093 (2006.01); G11C 29/02 (2006.01); G11C 29/50 (2006.01); G11C 8/18 (2006.01); G11C 11/401 (2006.01);
U.S. Cl.
CPC ...
G11C 7/1048 (2013.01); G06F 13/4243 (2013.01); G06F 13/4256 (2013.01); G11C 7/10 (2013.01); G11C 8/18 (2013.01); G11C 11/4093 (2013.01); G11C 29/028 (2013.01); G11C 29/50012 (2013.01); G11C 11/401 (2013.01);
Abstract

A memory system of a high-speed operation can be realized by reducing an influence of reflection signals etc. caused by branching and impedance mismatching in various wirings between a memory controller and a memory module, and an influence due to transmission delays of data, command/address, and clocks in the memory module. To this end, a memory system comprises a memory controller and a memory module mounted with DRAMs. A buffer is mounted on the memory module. The buffer and the memory controller are connected to each other via data wiring, command/address wiring, and clock wiring. The DRAMs and the buffer on the memory module are connected to each other via internal data wiring, internal command/address wiring, and internal cock wiring. The data wiring, the command/address wiring, and the clock wiring may be connected to buffers of other memory modules in cascade. Between the DRAMs and the buffer on the memory module, high-speed data transmission is implemented using data phase signals synchronous with clocks.


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