The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Apr. 05, 2021
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Kota Tokuda, Kawasaki Kanagawa, JP;

Nobuhiro Yamamoto, Yokohama Kanagawa, JP;

Yousuke Hisakuni, Sagamihara Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H02K 11/30 (2016.01); H02K 41/035 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4806 (2013.01); H02K 11/30 (2016.01); H02K 41/0356 (2013.01); H05K 1/028 (2013.01); H05K 1/111 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H02K 2211/03 (2013.01); H05K 2201/055 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10522 (2013.01);
Abstract

According to one embodiment, a wiring board unit includes a reinforcing board, a flexible printed circuit board includes a joint portion including a first plane and a second plane and attached on the reinforcing board, a relay unit extending from the first plane, a plurality of connection pad groups located on one of the first plane and the second plane and a first IC chip mounted on the first plane, and the joint portion is bent on a boundary between the first plane and the second plane.


Find Patent Forward Citations

Loading…