The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Dec. 21, 2018
Applicant:

Nvidia Corporation, Santa Clara, CA (US);

Inventors:

Shantanu Sarangi, Santa Clara, CA (US);

Jae Wu, Santa Clara, CA (US);

Andi Skende, Santa Clara, CA (US);

Rajith Mavila, Santa Clara, CA (US);

Assignee:

Nvidia Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/317 (2006.01); G01R 31/3187 (2006.01); G01R 31/3177 (2006.01); G06F 11/14 (2006.01); G06F 11/36 (2006.01); G06F 11/27 (2006.01); G06F 11/22 (2006.01); G01R 31/3181 (2006.01); G01R 31/3185 (2006.01); G06F 11/273 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31724 (2013.01); G01R 31/3177 (2013.01); G01R 31/3187 (2013.01); G01R 31/31813 (2013.01); G01R 31/318555 (2013.01); G06F 11/1417 (2013.01); G06F 11/2268 (2013.01); G06F 11/27 (2013.01); G06F 11/273 (2013.01); G06F 11/3688 (2013.01);
Abstract

Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.


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