The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Nov. 19, 2019
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

I-Hung Chiang, Changhua County, TW;

Hung-Hsien Ko, Hsinchu County, TW;

Cheng-Ta Pan, Kaohsiung, TW;

Wen-Yung Yeh, Hsinchu County, TW;

Cheng-Chung Lee, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/16 (2006.01); G01N 3/24 (2006.01); G01L 1/24 (2006.01);
U.S. Cl.
CPC ...
G01B 11/16 (2013.01); G01L 1/24 (2013.01); G01N 3/24 (2013.01); G01N 2203/0025 (2013.01);
Abstract

A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.


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