The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Sep. 15, 2020
Applicant:

Rinnai Corporation, Aichi, JP;

Inventor:

Kazuyuki Akagi, Aichi, JP;

Assignee:

Rinnai Corporation, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 3/06 (2006.01); F24H 9/1809 (2022.01); F28F 1/32 (2006.01); F28D 1/047 (2006.01);
U.S. Cl.
CPC ...
F28F 3/06 (2013.01); F24H 9/1809 (2013.01); F28D 1/0477 (2013.01); F28F 1/325 (2013.01); F28F 2215/08 (2013.01); F28F 2265/26 (2013.01);
Abstract

A heat exchanger prevents cracking in heat transfer plates while avoiding lowering heat-exchange efficiency. Heat transfer plates are arranged with a space between them, and a hollow pipe extends through the plates. A high-temperature gas flows through the space to exchange heat with a liquid in the hollow pipe. The heat transfer plates are elongated in the direction in which parts of the hollow pipe are aligned and can thus have thermal expansion accumulating in the elongation direction. The heat transfer plates each include a thermal expansion absorber between an edge of the heat transfer plate receiving inflow of the high-temperature gas and an inter-pipe portion between adjacent parts of the hollow pipe to absorb thermal expansion of the heat transfer plate. A selected one or more of the inter-pipe portions, rather than all, include the thermal expansion absorber.


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