The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jul. 08, 2020
Applicant:
Elite Material Co., Ltd., Taoyuan, TW;
Inventor:
Ching-Hsien Hsu, Taoyuan, TW;
Assignee:
ELITE MATERIAL CO., LTD., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08L 79/08 (2006.01); C08L 63/00 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); B32B 27/26 (2013.01); B32B 27/281 (2013.01); B32B 27/38 (2013.01); C08G 59/245 (2013.01); C08G 59/5033 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08J 2379/08 (2013.01); C08J 2463/00 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); C08L 2207/53 (2013.01);
Abstract
A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.