The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jun. 14, 2018
Robert Bosch Gmbh, Stuttgart, DE;
Andreas Scheurle, Leonberg, DE;
Bernd Klein, Reutlingen, DE;
Heinz Nedelmann, Tuebingen, DE;
Heribert Weber, Nuertingen, DE;
Isolde Simon, Kusterdingen, DE;
Martin Lapisa, Metzingen, DE;
Melissa Delheusy, Filderstadt, DE;
Michael Knauss, Pfullingen, DE;
Raschid Baraki, Reutlingen, DE;
Vitaliy Kondrashov, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.