The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Sep. 21, 2020
Canon Kabushiki Kaisha, Tokyo, JP;
Toshio Kashino, Fujisawa, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
In a liquid ejecting head, an electrical connection portion between an element substrate and a wiring substrate can be satisfactorily sealed, and a decrease in yield and an increase in manufacturing cost can be suppressed. The liquid ejecting head includes the element substrate having a plurality of energy generating elements and a plurality of electrodes, and the wiring substrate having a plurality of electrode terminals connected to the plurality of electrodes. The element substrate and the wiring substrate are overlapped with each other in a state where the electrode and the electrode terminal face each other, a connection portion is surrounded by a resin layer, and the resin layer is covered with a sealing resin. The resin layer is divided into a plurality of portions by a gap provided in a portion between both end portions of the electrode terminal in an arrangement direction. An inside of the gap is filled with the sealing resin.