The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Aug. 05, 2019
Applicant:
Toyo Kohan Co., Ltd, Tokyo, JP;
Inventors:
Yusuke Hashimoto, Yamaguchi, JP;
Teppei Kurokawa, Yamaguchi, JP;
Assignee:
Toyo Kohan Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); B32B 15/01 (2006.01); B23K 20/04 (2006.01); B23K 20/24 (2006.01); B32B 3/30 (2006.01); C23F 4/00 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
B32B 15/015 (2013.01); B23K 20/04 (2013.01); B23K 20/24 (2013.01); B32B 3/30 (2013.01); B32B 15/20 (2013.01); C23F 4/00 (2013.01); B23K 2103/05 (2018.08); B23K 2103/12 (2018.08); B32B 2307/212 (2013.01); B32B 2457/00 (2013.01); Y10T 428/12924 (2015.01);
Abstract
This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminateA is composed of a copper layerA and a stainless steel layerA, in which thickness of the roll-bonded laminateA is 0.02 mm to 0.4 mm, hardness of the copper layerA is 70 Hv or higher, and 180° peel strength of the roll-bonded laminateA is 6 N/20 mm or more.