The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Aug. 17, 2017
Applicants:

Imec Vzw, Leuven, BE;

Universiteit Gent, Ghent, BE;

Inventors:

Jan Vanfleteren, Ghent, BE;

Frederick Bossuyt, Ghent, BE;

Bart Plovie, Bekegem, BE;

Assignee:

IMEC VZW, Ghent, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); G06F 30/392 (2020.01); B29C 51/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0005 (2013.01); B29C 51/46 (2013.01); G06F 30/392 (2020.01); H05K 1/0283 (2013.01); H05K 1/189 (2013.01); H05K 3/007 (2013.01); H05K 3/0014 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); B29L 2031/3425 (2013.01); H05K 1/0274 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/057 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/209 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

Methods are provided for manufacturing flat devices to be used for forming a shape-retaining non-flat device by deformation of the flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.


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