The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Oct. 29, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Atsushi Kasuya, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); H05K 1/0278 (2013.01); H05K 1/111 (2013.01); H05K 1/119 (2013.01); H05K 1/0277 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 2201/0141 (2013.01);
Abstract
A resin multilayer substrate includes a stacked body including a first main surface, a cavity provided in the first main surface, and conductor patterns provided in the stacked body. The stacked body includes insulating substrate layers including resin as a main material that are stacked. The cavity includes a side surface and a bottom surface. At least a portion of a boundary between the side surface and the bottom surface includes conductor patterns continuous with the side surface and the bottom surface.