The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Dec. 15, 2020
Qualcomm Incorporated, San Diego, CA (US);
Xiaoming Chen, San Diego, CA (US);
Darryl Sheldon Jessie, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Certain aspects of the present disclosure generally relate to a circuit board with ground vias offset from associated ground bumps. One example circuit board generally includes a first signal connection terminal configured to connect a signal line of the circuit board to an integrated circuit (IC); a ground plane having a first ground connection terminal disposed adjacent to the first signal connection terminal, the first ground connection terminal being configured to provide a ground connection between the ground plane and the IC; and a first ground via associated with and disposed adjacent to the first ground connection terminal and coupled to the ground plane, wherein, from an overhead view of the circuit board, the first ground via is located at a position that is offset from a first axis on which the first signal connection terminal and the first ground connection terminal are disposed.