The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Aug. 13, 2019
Applicant:
Lasertel, Inc., Tucson, AZ (US);
Inventors:
Eric Paul Ruben, Tucson, AZ (US);
Jean Michel Maillard, Tucson, AZ (US);
Prabhu Thiagarajan, Tucson, AZ (US);
Assignee:
LEONARDO ELECTRONICS US INC., Tucson, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H03K 17/14 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H03K 17/145 (2013.01); H05K 1/0313 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.