The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Nov. 16, 2017
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Gwan Yong Lee, Gyeongsangbuk-do, KR;

Cheol Hwang, Gyeongsangbuk-do, KR;

Dohyun Ahn, Gyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); G02B 7/02 (2021.01); H04N 5/335 (2011.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); G02B 7/02 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 5/335 (2013.01); H05K 1/0272 (2013.01); H05K 1/118 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 3/34 (2013.01);
Abstract

A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.


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