The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Apr. 13, 2018
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Chad Balling McBride, North Bend, WA (US);

Amol Ashok Ambardekar, Redmond, WA (US);

Kent D. Cedola, Bellevue, WA (US);

Boris Bobrov, Kirkland, WA (US);

George Petre, Redmond, WA (US);

Larry Marvin Wall, Seattle, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/02 (2006.01); H03M 7/30 (2006.01); G06N 3/04 (2006.01); G06N 3/063 (2006.01); G06F 12/0862 (2016.01); G06F 9/46 (2006.01); G06F 1/324 (2019.01); G06F 3/06 (2006.01); G06F 9/38 (2018.01); G06F 12/08 (2016.01); G06F 12/10 (2016.01); G06F 15/80 (2006.01); G06F 17/15 (2006.01); G06N 3/06 (2006.01); G06N 3/08 (2006.01); G06N 3/10 (2006.01); H04L 45/02 (2022.01); H04L 67/02 (2022.01); H04L 67/1001 (2022.01); G06F 9/30 (2018.01); G06F 13/16 (2006.01); G06F 1/3234 (2019.01); G06F 13/28 (2006.01); H03M 7/46 (2006.01); H04L 45/50 (2022.01);
U.S. Cl.
CPC ...
H03M 7/3059 (2013.01); G06F 1/324 (2013.01); G06F 1/3275 (2013.01); G06F 3/0604 (2013.01); G06F 3/067 (2013.01); G06F 3/0631 (2013.01); G06F 9/30087 (2013.01); G06F 9/3836 (2013.01); G06F 9/3887 (2013.01); G06F 9/46 (2013.01); G06F 12/0207 (2013.01); G06F 12/08 (2013.01); G06F 12/0862 (2013.01); G06F 12/10 (2013.01); G06F 13/1673 (2013.01); G06F 13/1689 (2013.01); G06F 13/28 (2013.01); G06F 15/8007 (2013.01); G06F 17/15 (2013.01); G06N 3/04 (2013.01); G06N 3/049 (2013.01); G06N 3/0454 (2013.01); G06N 3/06 (2013.01); G06N 3/063 (2013.01); G06N 3/0635 (2013.01); G06N 3/08 (2013.01); G06N 3/10 (2013.01); H03M 7/6005 (2013.01); H03M 7/6011 (2013.01); H03M 7/70 (2013.01); H04L 45/04 (2013.01); H04L 67/02 (2013.01); H04L 67/1002 (2013.01); G06F 2209/484 (2013.01); G06F 2209/485 (2013.01); G06F 2212/657 (2013.01); H03M 7/46 (2013.01); H04L 45/50 (2013.01); Y02D 10/00 (2018.01);
Abstract

An exemplary artificial intelligence/machine learning hardware computing environment having an exemplary DNN module cooperating with one or more memory components can perform data sharing and distribution as well reuse of a buffer data to reduce the number of memory component read/writes thereby enhancing overall hardware performance and reducing power consumption. Illustratively, data from a cooperating memory component is read according to a selected operation of the exemplary hardware and written to corresponding other memory component for use by one or more processing elements (e.g., neurons). The data is read in such a manner to optimize the engagement of the one or more processing elements for each processing cycle as well as to reuse data previously stored in the one or more cooperating memory components. Operatively, the written data is copied to a shadow memory buffer prior to being consumed by the processing elements.


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