The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Dec. 06, 2018
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Stefan Majoni, Weil Im Schoenbuch, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/30 (2006.01); H03H 3/007 (2006.01); B81C 1/00 (2006.01); H01L 41/047 (2006.01); H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
H03H 3/0072 (2013.01); B81C 1/00476 (2013.01); H01L 41/047 (2013.01); H01L 41/081 (2013.01); B81B 2201/0271 (2013.01);
Abstract

A method for manufacturing a micromechanical layer structure, including: providing a first protective layer patterned to have at least one opening which is filled with sacrificial layer material; depositing a functional-layer layer structure; producing a first opening in the functional-layer layer structure to at least one opening of the first protective layer, so that in at least one of the layers of the functional-layer layer structure; depositing a second protective layer so that the first opening is filled with material of the second protective layer; patterning the second protective layer and the filled first opening to have a second opening to the first protective layer, the second opening having the same or a lesser width than the first opening; removing sacrificial layer material at least in the opening of the first protective layer; and removing protective layer material at least in the second opening.


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