The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

May. 14, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventor:

Hiroyasu Sugiura, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 11/40 (2016.01); B60R 16/03 (2006.01); B62D 5/04 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 11/40 (2016.01); B60R 16/03 (2013.01); B62D 5/04 (2013.01); H02K 2211/03 (2013.01); H02K 2213/06 (2013.01); H05K 1/0298 (2013.01); H05K 1/036 (2013.01); H05K 1/185 (2013.01);
Abstract

A power conversion device comprise: a power conversion circuit that is configured to convert a supplied electric power to output the converted power; a control circuit that is configured to control an operation of the power conversion circuit; a multilayer substrate that has a different layers, power wiring patterns of the power conversion circuit and a control wiring pattern of the control circuit being arranged on the multilayer substrate, the power wiring patterns being disposed in different layers of the multilayer substrate; a via that extends across the power wiring patterns in the different layers; and a solid-shaped conductive member that is provided in the via to electrically connect the respective power wiring patterns to each other.


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