The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Dec. 05, 2019
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Rolf Weis, Dresden, DE;

Richard Hensch, Dresden, DE;

Ahmed Mahmoud, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 21/2253 (2013.01); H01L 21/26513 (2013.01); H01L 21/324 (2013.01); H01L 29/1095 (2013.01); H01L 29/66712 (2013.01); H01L 29/7805 (2013.01);
Abstract

A method includes forming a layer stack with a plurality of first layers of a first doping type and a plurality of second layers of a second doping type complementary to the first doping type on top of a carrier. Forming the layer stack includes forming a plurality of epitaxial layers on the carrier. Forming each of the plurality of epitaxial layers includes depositing a layer of semiconductor material, forming at least two first implantation regions of one of a first type or a second type at different vertical positions of the respective layer of semiconductor material, and forming at least one second implantation region of a type that is complementary to the type of the first implantation regions, the first implantation regions and the second implantation regions being arranged alternatingly.


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