The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

May. 04, 2018
Applicant:

Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Ivan-Christophe Robin, Grenoble, FR;

Stéphane Caplet, Sassenage, FR;

Marie-Claire Cyrille, Sinard, FR;

Bertrand Delaet, Bernin, FR;

Sophie Giroud, Saint-Egreve, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 33/32 (2010.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/6835 (2013.01); H01L 24/08 (2013.01); H01L 24/89 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/62 (2013.01); H01L 2221/68363 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/08237 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80099 (2013.01); H01L 2224/80121 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of manufacturing an electronic device, including: a) forming a plurality of chips, each including a plurality of connection areas and at least one first pad; b) forming a transfer substrate including, for each chip, a plurality of connection areas and at least one second pad, one of the first and second pads being a permanent magnet and the other one of the first and second pads being either a permanent magnet or made of a ferromagnetic material; and c) affixing the chips to the transfer substrate to connect the connection areas of the chips to the connection areas of the transfer substrate, by using the magnetic force between the pads to align the connection areas of the chips with the corresponding connection areas of the transfer substrate.


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