The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Jan. 22, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Dmitry S. Sizov, Cupertino, CA (US);

Ion Bita, Santa Clara, CA (US);

Jean-Jacques P. Drolet, Bavaria, DE;

John T. Leonard, San Jose, CA (US);

Jonathan S. Steckel, Cupertino, CA (US);

Nathaniel T. Lawrence, San Francisco, CA (US);

Xiaobin Xin, Sunnyvale, CA (US);

Ranojoy Bose, Fremont, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 25/18 (2006.01); H01L 33/60 (2010.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/60 (2013.01); H01L 33/0008 (2013.01); H01L 33/0093 (2020.05); H01L 33/38 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/32225 (2013.01);
Abstract

Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.


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