The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Aug. 23, 2018
Applicant:
Kaijo Corporation, Tokyo, JP;
Inventors:
Assignee:
KAIJO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/005 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/78268 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78354 (2013.01); H01L 2224/78804 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85206 (2013.01); H01L 2224/85207 (2013.01);
Abstract
A wire bonding method includes bringing a capillary and a wire inserted through the capillary into pressure contact with a bonding point of a lead placed on an XY stage to bond the wire to the lead, including moving the XY stage in a state in which the capillary is in pressure contact with the lead to move the capillary along a movement locus including a plurality of arc portions.