The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Nov. 25, 2019
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventor:
Seiichiro Shinohara, Kanuma, JP;
Assignee:
DEXERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B32B 3/26 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/24 (2006.01); B32B 38/00 (2006.01); C08G 59/68 (2006.01); H05K 3/32 (2006.01); C09J 4/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B32B 3/263 (2013.01); B32B 37/025 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/24 (2013.01); B32B 38/0008 (2013.01); C08G 59/68 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H05K 3/323 (2013.01); B32B 2037/243 (2013.01); B32B 2305/30 (2013.01); B32B 2307/202 (2013.01); B32B 2457/00 (2013.01); C09J 4/00 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27005 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0215 (2013.01); Y10T 428/24521 (2015.01);
Abstract
An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.