The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Apr. 15, 2020
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Jihwang Kim, Cheonan-si, KR;
Jeongmin Kang, Seoul, KR;
Hyunkyu Kim, Yongin-si, KR;
Jongbo Shim, Asan-si, KR;
Kyoungsei Choi, Yongin-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do, KR;
Abstract
A semiconductor package is provided including a package substrate. The package substrate includes a substrate pattern and a substrate insulation layer at least partially surrounding the substrate pattern. The package substrate has a groove. An external connection terminal is disposed below the package substrate. An embedded semiconductor device is disposed within the groove of the package substrate. The embedded semiconductor device includes a first substrate. A first active layer is disposed on the first substrate. A first chip pad is disposed on the first active layer. A buried insulation layer is disposed within the groove of the package substrate and at least partially surrounds at least a portion of a lateral surface of the embedded semiconductor device. A mounted semiconductor device is disposed on the package substrate and is connected to the package substrate and the embedded semiconductor device.