The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Jan. 23, 2018
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventor:

Binbin Cao, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/12 (2020.01); H01L 21/66 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 31/1227 (2013.01); H01L 22/12 (2013.01); H01L 27/124 (2013.01); H01L 27/1225 (2013.01); H01L 27/1259 (2013.01); H01L 29/7869 (2013.01);
Abstract

The present disclosure provides an array substrate, a fabrication method thereof and a display device. The array substrate includes an insulating layer provided with a first via therein. The array substrate further includes a detection structure including a first conductive structure, a second conductive structure and an insulating structure therebetween. The insulating structure is a portion of the insulating layer. The second conductive structure includes a first portion and a second portion which are separated from each other, and the first portion and the second portion partially overlap with the first conductive structure in a thickness direction of the array substrate, respectively. A second via is provided in the insulating structure between overlapping portions of the first portion and the first conductive structure, and a third via is provided in the insulating structure between overlapping portions of the second portion and the first conductive structure.


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