The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Dec. 10, 2020
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Hye Rim Kwon, Incheon, KR;

Tae Bong Kim, Gyeonggi-do, KR;

Dong Jin Son, Chungcheongnam-do, KR;

Sung Woo Yu, Gyeonggi-do, KR;

Min Ho Lim, Seoul, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/045 (2006.01); B32B 7/12 (2006.01); B32B 23/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B32B 7/12 (2013.01); B32B 23/08 (2013.01); B32B 27/306 (2013.01); B32B 27/36 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04102 (2013.01);
Abstract

A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including sensing electrodes and traces branching from the sensing electrodes, a flexible circuit board electrically connected to the traces at one end portion of a top surface of the touch sensor layer, a supporting structure commonly and partially covering the flexible circuit board and the touch sensor layer, and an adhesive layer formed on at least one surface of the touch sensor layer. The adhesive layer has a flexural rigidity in a range from 0.01 to 5 N·nm. Damages and delamination of electrodes and wirings included in the flexible circuit board and the touch sensor layer are prevented by the supporting structure.


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