The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Jul. 01, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Matthew E. Colburn, Woodinville, WA (US);

Giuseppe Calafiore, Redmond, WA (US);

Matthieu Charles Raoul Leibovici, Seattle, WA (US);

Nihar Ranjan Mohanty, Snoqualmie, WA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/124 (2006.01); G02B 27/01 (2006.01); H01J 37/305 (2006.01); H01L 21/321 (2006.01); H01L 21/027 (2006.01); G02B 5/18 (2006.01); G02B 6/12 (2006.01); G02B 6/34 (2006.01);
U.S. Cl.
CPC ...
G02B 6/124 (2013.01); G02B 5/1857 (2013.01); G02B 27/0172 (2013.01); H01J 37/3056 (2013.01); H01L 21/0274 (2013.01); H01L 21/3212 (2013.01); G02B 5/1809 (2013.01); G02B 6/34 (2013.01); G02B 2006/12107 (2013.01); H01J 2237/08 (2013.01); H01J 2237/0812 (2013.01);
Abstract

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of depths relative to the substrate. The manufacturing system performs a deposition of a second material over the profile created in the etch-compatible film. The manufacturing system performs a planarization of the second material to obtain a plurality of etch heights of the second material in accordance with the plurality of depths in the profile created in the etch-compatible film. The manufacturing system performs a lithographic patterning of a photoresist deposited over the planarized second material to obtain the plurality of etch heights and one or more duty cycles in the second material.


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