The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Dec. 07, 2020
Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Nobuyuki Hatanaka, Osaka, JP;

Tadahiro Kobayashi, Osaka, JP;

Akira Yokota, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/30 (2006.01); B32B 27/00 (2006.01); B32B 38/10 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G02B 5/3041 (2013.01); B32B 27/00 (2013.01); G02B 5/3083 (2013.01); B32B 37/1284 (2013.01); B32B 38/10 (2013.01); B32B 2307/40 (2013.01);
Abstract

Method for producing a thin optical laminated body. This method is a method for producing a laminated body including a polarization layer, a λ/2 layer, a λ/4 layer, a positive C layer, and a transfer adhesive layer, the laminated body including the polarization layer, the λ/2 layer and the λ/4 layer in this member-described order; including the positive C layer between the polarization layer and the λ/4 layer, or at the side of the λ/4 layer that is opposite to the λ/2-layer-arranged side of the λ/4 layer; and including the transfer adhesive layer between the polarization layer and the λ/4 layer or positive C layer, the method including the step of bonding a bonding body including a substrate and the transfer adhesive layer to an adherend through the transfer adhesive layer, and peeling the substrate from the resultant.


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