The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Feb. 17, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Shinya Yamazaki, Shiojiri, JP;

Osamu Murayama, Yamagata-mura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 15/08 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
G01S 15/08 (2013.01); B41J 2/04526 (2013.01); B41J 2/04586 (2013.01);
Abstract

A sonic wave sensor unit includes an element substrate having a transmitting element having a transmission side piezoelectric element and transmitting a sonic wave to a medium, and a receiving element having a reception side piezoelectric element and a reception side vibrating surface and receiving a sonic wave reflected by the medium, a sonic wave sensor including a sealing substrate configured to seal the transmission side piezoelectric element and the reception side piezoelectric element, and a holder disposed on a side opposite to the element substrate with respect to the sealing substrate in a −Z direction and fixed to the sealing substrate, wherein a through hole penetrating the holder in the −Z direction is formed in the holder, and, in plan view viewed in the −Z direction, the reception side vibrating surface is disposed inside a wall surface of the holder constituting the through hole.


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