The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

May. 15, 2019
Applicant:

Mitsuba Corporation, Gunma, JP;

Inventors:

Takayuki Ikeda, Gunma, JP;

Tsuyoshi Maruyama, Gunma, JP;

Akihiro Iino, Gunma, JP;

Yasuhiro Tsukahara, Gunma, JP;

Yohei Inagaki, Gunma, JP;

Takao Fueki, Gunma, JP;

Assignee:

MITSUBA Corporation, Gunma, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E05F 15/46 (2015.01); B60J 5/10 (2006.01); H03K 17/96 (2006.01);
U.S. Cl.
CPC ...
E05F 15/46 (2015.01); B60J 5/107 (2013.01); H03K 17/962 (2013.01); E05Y 2900/546 (2013.01); H03K 2017/9602 (2013.01); H03K 2217/96078 (2013.01);
Abstract

A sensor unit manufacturing method includes: a core metal insertion process of inserting a core metal member having a length dimension smaller than a length dimension of a core metal accommodation portion into a predetermined location (a section of a curving portion) extending along a longitudinal direction of the core metal accommodation portion; and a bending process of bending the section (the section of the curving portion) of a fixation base portion, into which the core metal member is inserted, following a curved shape of a sensor bracket.


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