The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

May. 17, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Akihiro Harada, Tokyo, JP;

Hiroyuki Matsumoto, Tokyo, JP;

Kenji Horino, Tokyo, JP;

Kazuhiro Yoshidome, Tokyo, JP;

Akito Hasegawa, Tokyo, JP;

Hajime Amano, Tokyo, JP;

Kensuke Ara, Tokyo, JP;

Seigo Tokoro, Tokyo, JP;

Masakazu Hosono, Tokyo, JP;

Takuma Nakano, Tokyo, JP;

Satoko Mori, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/16 (2006.01); C22C 38/02 (2006.01); C22C 38/00 (2006.01); C22C 38/14 (2006.01); C22C 38/12 (2006.01); C22C 38/10 (2006.01); C22C 38/08 (2006.01); H01F 1/153 (2006.01); C22C 45/02 (2006.01); B22F 1/00 (2022.01); B22F 3/00 (2021.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); H01F 1/147 (2006.01); H01F 1/12 (2006.01); C22C 45/00 (2006.01); H01F 1/14 (2006.01); C22C 38/26 (2006.01); C22C 33/02 (2006.01); H01F 41/02 (2006.01); B22F 1/07 (2022.01); C21D 6/00 (2006.01); B22F 9/08 (2006.01);
U.S. Cl.
CPC ...
C22C 38/16 (2013.01); B22F 1/00 (2013.01); B22F 1/07 (2022.01); B22F 3/00 (2013.01); C22C 33/0278 (2013.01); C22C 38/00 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/007 (2013.01); C22C 38/008 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/10 (2013.01); C22C 38/105 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/26 (2013.01); C22C 45/008 (2013.01); C22C 45/02 (2013.01); H01F 1/12 (2013.01); H01F 1/14 (2013.01); H01F 1/14708 (2013.01); H01F 1/14716 (2013.01); H01F 1/14733 (2013.01); H01F 1/153 (2013.01); H01F 1/15308 (2013.01); H01F 1/15325 (2013.01); H01F 1/15333 (2013.01); H01F 41/0246 (2013.01); B22F 2009/0824 (2013.01); B22F 2009/0828 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C21D 6/00 (2013.01); C22C 2202/02 (2013.01); Y10T 428/12465 (2015.01); Y10T 428/12951 (2015.01);
Abstract

Provided is a soft magnetic alloy having a composition of a compositional formula (FeX1X2)))PCSiCuM. X1 is one or more selected from a group consisting of Co and Ni, X2 is one or more selected from a group consisting of Al, Mn, Ag, Zn, Sn, As, Sb, Bi, N, 0, and rare earth elements, and M is one or more selected from the group consisting of Nb, Hf, Zr, Ta, Ti, Mo, W and V. 0.050≤a≤0.17, 0<b<0.050, 0.030<c≤0.10, 0<d≤0.020, 0≤e≤0.030, α≥0, β≥0, and 0≤α+β≤0.50.


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