The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Apr. 22, 2021
Applicant:

Admatechs Co., Ltd., Miyoshi, JP;

Inventors:

Shingi Noguchi, Miyoshi, JP;

Masaru Kuraki, Miyoshi, JP;

Tempo Nakamura, Miyoshi, JP;

Yoshinori Okawauchi, Miyoshi, JP;

Assignee:

ADMATECHS CO., LTD., Miyoshi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/013 (2018.01); C08L 83/06 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); C08K 3/013 (2018.01); C08K 3/22 (2013.01); C08K 2003/2227 (2013.01);
Abstract

Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)Si—(SiR—O—)—SiR(in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.


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