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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11401407 B1

PDFFull Text
Date of Patent:
Aug. 02, 2022

Filed:

May. 01, 2019

Resin composition and multilayered structure using same

Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Honoka Hashimoto, Tokyo, JP;

Shinji Nakanishi, Tokyo, JP;

Kazuya Furukawa, Tokyo, JP;

Assignee:

MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Christopher M Rodd

Int. Cl.
CPC ...
C08L 29/04 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); C08K 3/26 (2006.01); C08K 3/30 (2006.01); C08K 5/098 (2006.01); C08L 77/02 (2006.01); C08L 77/06 (2006.01); C08K 3/00 (2018.01); C08L 77/00 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08L 29/04 (2013.01); B32B 27/306 (2013.01); B32B 27/34 (2013.01); C08K 3/00 (2013.01); C08K 3/26 (2013.01); C08K 3/30 (2013.01); C08K 5/00 (2013.01); C08K 5/098 (2013.01); C08L 77/00 (2013.01); C08L 77/02 (2013.01); C08L 77/06 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/7248 (2013.01); B32B 2439/70 (2013.01); C08K 2003/267 (2013.01); C08K 2003/3063 (2013.01);
Abstract

Provided is a resin composition comprising an ethylene-vinyl alcohol copolymer (A), a hydrate-forming metal salt (B), and a polyamide-based resin (C) that inhibits elution of a resin composition layer during hot water sterilization treatment of a multilayered structure including the resin composition layer, while suppressing odor during melt molding of the resin composition. An aromatic polyamide (C1) and an aliphatic polyamide (C2) are used for the polyamide-based resin (C) at a proportion of (C1)/(C2)=55/45-99/1.

Find Patent Forward Citations

Hashimoto, Honoka. (2022). Resin composition and multilayered structure using same (U.S. Patent No. 11401407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11401407

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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