The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Aug. 21, 2017
Applicant:

Lpkf Laser & Electronics Ag, Garbsen, DE;

Inventors:

Robin Alexander Krueger, Hannover, DE;

Norbert Ambrosius, Kevelaer, DE;

Roman Ostholt, Langenhagen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B 33/02 (2006.01); B23K 26/53 (2014.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); C03B 33/033 (2006.01); C03B 33/09 (2006.01); B23K 26/064 (2014.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); C03C 15/00 (2006.01); C03C 17/00 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/0006 (2013.01); B23K 26/064 (2015.10); B23K 26/0619 (2015.10); B23K 26/0624 (2015.10); B23K 26/364 (2015.10); B23K 26/402 (2013.01); B23K 26/53 (2015.10); C03B 33/033 (2013.01); C03B 33/091 (2013.01); C03C 15/00 (2013.01); C03C 17/002 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); C03C 2218/32 (2013.01);
Abstract

An aspect of the invention provides a device, comprising: a laser machining head configured to deflect laser radiation onto an optical system comprising a substrate, the device being configured to carry out a method for separating the substrate using the optical system, the optical system being configured to provide the laser radiation, a thickness of the substrate not exceeding 2 mm in a region of a separating line, the method comprising: applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate using the optical system, the substrate material being transparent at least in part to a laser wavelength of the pulsed laser radiation, the pulsed laser radiation being focused using the optical system at an original focal depth (f), an intensity of the pulsed laser radiation leading to a modification of the substrate along a beam axis (Z) of the pulsed laser radiation.


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