The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Feb. 11, 2019
Applicant:

Versana Micro Inc., Scottsdale, AZ (US);

Inventor:

Bishnu Prasanna Gogoi, Scottsdale, AZ (US);

Assignee:

Versana Micro Inc., Scottsdale, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); H01L 27/14 (2006.01); H01L 27/22 (2006.01); H01L 41/113 (2006.01); H01L 27/16 (2006.01); H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); H01L 27/14 (2013.01); H01L 27/16 (2013.01); H01L 27/22 (2013.01); H01L 41/1132 (2013.01); H01L 41/1138 (2013.01); H05K 7/02 (2013.01); B81B 2201/0207 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0228 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0278 (2013.01); B81B 2207/012 (2013.01); B81B 2207/05 (2013.01); B81B 2207/09 (2013.01); H01L 2924/00 (2013.01);
Abstract

A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able to collect data about the environment in a distributed manner. For example, a first sensor node and a second sensor node is formed respectively in a first region and a second region of the semiconductor substrate. A flexible interconnect is formed overlying the semiconductor substrate and couples the first sensor node to the second sensor node. A portion of the semiconductor substrate is removed by etching beneath the flexible interconnect such that the distributed sensor system has multiple degrees of freedom that support following surface contours or sudden changes of direction.


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