The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Sep. 29, 2014
Dai Nippon Printing Co., Ltd., Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
Provided is a hygroscopic packaging container which eliminates the necessity of filling a moisture absorbent and which has satisfactory working efficiency and is highly effective in moisture absorption. The hygroscopic packaging container is obtained from two gas-barrier multilayer films each comprising a gas-barrier layer and a heat-sealable layer, by stacking the gas-barrier multilayer films so that the surface of one of the heat-sealable layers overlies that of the other and heat-sealing the peripheral parts of the layers, at least one heat-sealable layer of the two gas-barrier multilayer films being a hygroscopic heat-sealable layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile