The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2022

Filed:

Apr. 30, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Wei Huang, Palo Alto, CA (US);

Gary J. Dispoto, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); G05B 19/4099 (2006.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G05B 19/4099 (2013.01); G05B 2219/49023 (2013.01);
Abstract

According to examples, an apparatus may include a fabricating system, a processor, and on memory on which are stored machine readable instructions. The instructions, when executed by the processor, may cause the processor to control the fabricating system to spread a first layer of build material as part of an object fabrication process, the build material comprising particles or a paste. The instructions may also cause the processor to control the fabricating system to selectively solidify a first area of the layer to a higher degree of solidification than a predefined second area encompassed by the first area, in which the predefined second area has a lower fracture toughness than the first area to propagate a crack in the object more readily than the first area.


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