The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
May. 21, 2018
Corning Incorporated, Corning, NY (US);
John Claude Cadotte, Jr., Waterboro, ME (US);
Michael Kurt Schaefer, Gorham, ME (US);
James Mark Seymour, Portland, ME (US);
Andrew Michael Zeimen, Bay City, MI (US);
CORNING INCORPORATED, Corning, NY (US);
Abstract
A method for producing pipettes () is provided. The method includes extruding a polymer melt into at least one mold segment of a mold assembly () having a plurality of mold segments to form a parison () or preform, wherein the plurality of mold segments () comprise cavities () that are shaped to form pipettes when in communication with the cavity of an adjacent mold segment; forming at least two pipettes in the shape of the mold segment cavities by blow-molding or vacuum forming the parison or preform, each of the at least two pipettes having proximal and distal ends; heating the pipettes to form a locally heated portion of the at least two pipettes; and separating the pipettes by cutting the locally heated portion of the at least two pipettes with separation feature ().