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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11400029 B1

PDFFull Text
Date of Patent:
Aug. 02, 2022

Filed:

Jan. 22, 2020

Dental porcelain paste superior in application property

Applicant:

Shofu Inc., Kyoto, JP;

Inventors:

Keita Kawata, Kyoto, JP;

Kenji Kono, Kyoto, JP;

Assignee:

SHOFU INC., Kyoto, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

C Melissa Koslow

Int. Cl.
CPC ...
A61K 6/836 (2020.01); A61K 6/65 (2020.01); A61K 6/853 (2020.01); A61K 6/78 (2020.01); A61K 6/17 (2020.01); A61K 6/76 (2020.01); A61K 6/833 (2020.01); C03C 8/16 (2006.01); C03C 8/14 (2006.01); C03C 14/00 (2006.01); C03C 1/04 (2006.01);
U.S. Cl.
CPC ...
A61K 6/836 (2020.01); A61K 6/17 (2020.01); A61K 6/65 (2020.01); A61K 6/76 (2020.01); A61K 6/78 (2020.01); A61K 6/833 (2020.01); A61K 6/853 (2020.01); C03C 1/04 (2013.01); C03C 8/14 (2013.01); C03C 8/16 (2013.01); C03C 14/004 (2013.01); C03C 2204/00 (2013.01); C03C 2205/06 (2013.01); C03C 2214/04 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/36 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/9646 (2013.01);
Abstract

To provide a dental porcelain paste which can maintain maintaining the paste state and have excellent application property for a long period of time and hardly causes carbonization or bubbles due to the influence of an organic component or a polymer component during firing. The present invention provides a dental porcelain paste for preparing a dental prosthesis device, comprising: 50.0 to 80.0 wt. % of a glass powder (a) having a maximum particle diameter of 100 μm or less and an average particle diameter of 1 to 20 μm, 0.5 to 10.0 wt. % of a hydrophobized fine particle silica (b) having an average primary particle diameter of 1 to 50 nm, and 10.0 to 49.5 wt. % of an organic solvent (c) having a boiling point it is within (bp) of 100 to 300° C.

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