The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Nov. 20, 2018
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Herman K. Phlegm, West Bloomfield, MI (US);

Mahmoud Abd Elhamid, Troy, MI (US);

Timothy J. Fuller, Pittsford, NY (US);

Mark O. Vann, Canton, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/653 (2014.01); H01M 10/6551 (2014.01); H01M 10/625 (2014.01); H01M 10/613 (2014.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); F28F 23/00 (2006.01); B60K 6/28 (2007.10); B60L 58/26 (2019.01); B60L 50/64 (2019.01);
U.S. Cl.
CPC ...
H01M 10/653 (2015.04); F28F 21/02 (2013.01); F28F 21/089 (2013.01); F28F 23/00 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/6551 (2015.04); B60K 6/28 (2013.01); B60L 50/64 (2019.02); B60L 58/26 (2019.02); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01); B60Y 2400/112 (2013.01); H01M 2220/20 (2013.01);
Abstract

A thermal interface member configured to be disposed between a heat sink and a heat-releasing device includes a thermal interface member. The thermal interface member has a thermally conductive, cure-in-place, polymer foam pad configured to maintain uniform contact with each of the heat sink and the heat-releasing device. The thermal interface member is additionally configured to absorb the thermal energy released by the heat-releasing device and direct the released thermal energy to the heat sink. The polymer foam pad has a matrix structure including at least one of anisotropic and isotropic thermally conductive anisotropic filler material, and is characterized by foam material density below 0.5 g/cm.


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