The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Apr. 06, 2018
Applicant:
Microlink Devices, Inc., Niles, IL (US);
Inventors:
Christopher Youtsey, Libertyville, IL (US);
Rekha Reddy, Chicago, IL (US);
Christopher Stender, Glenview, IL (US);
Assignee:
MICROLINK DEVICES, INC., Niles, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0463 (2014.01); H01L 31/048 (2014.01); H01L 31/05 (2014.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0392 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0463 (2014.12); H01L 31/022441 (2013.01); H01L 31/0392 (2013.01); H01L 31/048 (2013.01); H01L 31/0516 (2013.01); H01L 31/1892 (2013.01); H01L 21/02063 (2013.01); H01L 21/486 (2013.01); H01L 21/76829 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/76897 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05087 (2013.01); H01L 2225/06541 (2013.01); Y02E 10/50 (2013.01);
Abstract
Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.